• Industrial application:
    industrial personal computer (IPC)
  • Layer:
    8 layer board
  • Surface finish:
    ENIG
  • Industrial application:
    consumer product
  • Layer:
    14layer board
  • Surface finish:
    ENIG
  • Industrial application:
    control system
  • Layer:
    6 layer board
  • Surface finish:
    ENIG
  • Industrial application:
    computer peripherals
  • Layer:
    8 layer board
  • Surface finish:
    ENIG+edge
  • Industrial application:
    home appliance industry
  • Layer:
    4 layer board
  • Surface finish:
    ENIG
  • Industrial application:
    medical instrument
  • Layer:
    12 layer board
  • Surface finish:
    ENIG
  • Industrial application:
    communication products
  • Layer:
    4 layer board
  • Surface finish:
    ENIG
  • Industrial application:
    network products
  • Layer:
    6 layer board
  • Surface finish:
    lead-free HASL
  • Industrial application:
    surveillance produc
  • Layer:
    6 layer board
  • Surface finish:
    ENIGL
  • Industrial application:
    LED products
  • Layer:
    4 layer board
  • Surface finishz:
    ENIG
  • Industrial application:
    ununterruptible power supply(UPS)
  • layer:
    double layer board
  • Surface finishz:
    ENIG
  • Industrial application:
    HDI
  • Layer:
    10 layer board
  • Surface finish:
    ENIG
Green Product Environmental Convention
Restriction of the use of hazardous Substance announced by the European Union
1.In response to the provisions of the Intemational Environmental Protection Treaty, Tai Moon tests all itsproducts and makes sure they must comply with the provisions of international environmental protection
2.Theraw materials for testarematrix and solder mask. The test center is SGS Group- SociétéGenérale de Surveillance. Attached are the test reports and the tested products:
(1) The manufacturing of the product complies with the specifications of IPC-TM-650. The test board is made with matrix according to the production cinditions.
(2) The surface finish of the test board divided into (a) immersion sliver (b)electroless nickel immersion gold (c) organic solderability preservative (d) immersion tin (e) lead-free HASL
(3) The dimension of the test board is 245.4mmX184.5mmX10 PCS
(4) The test is conducted by Electronics Testing Center. The certification is verified by Chinese National Laboratory Accreditation and Germany TUV-PS laboratory.
The raw materials and products used products used and produced by Tai Moon confoem to Restriction of the Use of Hazardous Substance announced by the European Union. The raw materials and products are allowed to be use and produced.
Declaration of Minerals Conflict-free
In order to ensure that metal sources such as Tantalum (Ta), Tin (Sn), Gold (Au), and Tingsten (W) are not mined in conflict zones such as Democratic Republic of the Congo to avoid serious armed conflicts and human rights violations and to fulfill the corporate responsibility. We are reponsible for investigating all the metal and avoid non Conflict-Free Minerals. We abide by the following requirements.
1.Do not use metals such as Tantalum(Ta), Tin(Sn), Gold(Au), Tungsten(W) and other metals extracted in Democratic Republic of the Congo and other conflict zones which are affected by armed conflict, illegal mining and poor working conditions.
2.In the manufacturing process, do not use Tantalum(Ta), Tin(Sn), Gold(Au), Tungsten(W) and other metal minerals extracted in Demoratic Republic of the Congo and other conflict zones which are affected by armed conflict, illegal minimg and poor working conditions.